ABF Electroforming Template Processing & Application Fields

Product Features

1. Damage-free advanced process: Integrated electroforming deposition eliminates mechanical cutting and laser thermal damage without internal plate stress, preventing template warpage, deformation and cracking for long-term precision mass production.

2. Ultra-high pattern fidelity: Precise positioning by photolithography masks realizes over 99.5% pattern reproduction accuracy, featuring clean, burr-free and collapse-free hole edges without post-polishing.

3. Strong structural adaptability: Integral forming of microholes below 50μm, special-shaped holes and stepped holes; customizable thickness ranging 20–300μm to satisfy diverse demands of high-end packaging.

4. Excellent demolding performance: Smooth hole walls with optimized tapered cross-section and low-adhesion surface treatment minimize solder paste residue, tin beads and insufficient solder defects to raise printing yield.

5. Durable & easy maintenance: High-hardness substrate with great wear and chemical corrosion resistance tolerates repeated cleaning and high-frequency mass production, boasting far longer service life than etched and laser templates.

Product Performance

1. Dimensional precision: Micron-level tolerance control; overall dimensional tolerance ±0.005mm, hole precision up to ±0.001mm, ball positioning error within ±5μm.

2. Surface property: Hole wall roughness as low as Ra 0.05μm; flat and smooth board surface ensures uniform solder paste adhesion and smooth demolding without tin adhesion.

3. Stable performance: Stress-free forming guarantees outstanding batch dimensional consistency; high temperature and acid-alkali resistance prevents deformation and precision degradation during long-term use.

4. Mass production performance: Compatible with large-scale manufacturing and high yield; matches advanced packaging processes of 7nm/5nm chips for high-pin-count precision ball mounting.

5. Material performance: High-purity nickel-cobalt alloy substrate with high hardness and toughness resists wear and deformation, extending template service life and cutting production costs.

Application Fields

1. High-end semiconductor packaging: FC-BGA, BGA and CSP packaging on ABF substrates for precision chip ball mounting and solder paste printing, supporting advanced chip processes of 7nm and below.

2. Communication chips: Widely used in packaging of 5G/6G RF chips, baseband chips and high-speed communication chips to meet high-pin-count and high-density ball mounting precision requirements.

3. AI computing chips: Applied to packaging of AI chips, GPUs and computing processors to ensure precision and stability of high-density fine-pitch solder joints.

4. Consumer electronics chips: Precision ball mounting and packaging for main control and storage chips of mobile phones, tablets and smart terminals.

5. Industrial control & automotive electronics: Packaging of automotive power chips, industrial precision chips and IoT chips, complying with high-reliability standards for industrial and automotive grades.